JPH0710498Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0710498Y2
JPH0710498Y2 JP1988151281U JP15128188U JPH0710498Y2 JP H0710498 Y2 JPH0710498 Y2 JP H0710498Y2 JP 1988151281 U JP1988151281 U JP 1988151281U JP 15128188 U JP15128188 U JP 15128188U JP H0710498 Y2 JPH0710498 Y2 JP H0710498Y2
Authority
JP
Japan
Prior art keywords
lead
wide
width
wide portion
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988151281U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0272556U (en]
Inventor
和美 高畠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1988151281U priority Critical patent/JPH0710498Y2/ja
Publication of JPH0272556U publication Critical patent/JPH0272556U/ja
Application granted granted Critical
Publication of JPH0710498Y2 publication Critical patent/JPH0710498Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988151281U 1988-11-22 1988-11-22 半導体装置 Expired - Lifetime JPH0710498Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988151281U JPH0710498Y2 (ja) 1988-11-22 1988-11-22 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988151281U JPH0710498Y2 (ja) 1988-11-22 1988-11-22 半導体装置

Publications (2)

Publication Number Publication Date
JPH0272556U JPH0272556U (en]) 1990-06-01
JPH0710498Y2 true JPH0710498Y2 (ja) 1995-03-08

Family

ID=31425183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988151281U Expired - Lifetime JPH0710498Y2 (ja) 1988-11-22 1988-11-22 半導体装置

Country Status (1)

Country Link
JP (1) JPH0710498Y2 (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101016715B1 (ko) * 2008-04-15 2011-02-25 미쓰비시덴키 가부시키가이샤 반도체장치
JP5182245B2 (ja) * 2009-07-24 2013-04-17 株式会社大真空 リードタイプの電子部品
JP6015019B2 (ja) * 2012-02-09 2016-10-26 Fdk株式会社 巻線部品
JP6724800B2 (ja) * 2017-01-17 2020-07-15 三菱電機株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58144850U (ja) * 1982-03-24 1983-09-29 日本電気株式会社 多端子集積回路ケ−スの構造

Also Published As

Publication number Publication date
JPH0272556U (en]) 1990-06-01

Similar Documents

Publication Publication Date Title
WO2022233240A1 (zh) 功率半导体器件的封装结构与功率模块
JPH0710498Y2 (ja) 半導体装置
JPH02310954A (ja) リードフレーム及びそれを用いた半導体装置
JPS6180842A (ja) 半導体装置
JPS63166254A (ja) 半導体装置
JPH05326771A (ja) 電子デバイスにおける放熱器の取付け構造
JP3173890B2 (ja) ハイブリッドｉｃ
JP2501950B2 (ja) 半導体装置
JP2816496B2 (ja) 電子部品搭載用基板
JPH0563053U (ja) 混成集積回路基板
JP2882101B2 (ja) 半導体装置
JPS6329413B2 (en])
JP2713141B2 (ja) 半導体装置
JP2766401B2 (ja) 表面実装型半導体装置
JP2692656B2 (ja) 表面実装型半導体装置
JPS638142Y2 (en])
JP2979637B2 (ja) 半導体装置
JPH01248549A (ja) 半導体装置の製造方法
JPS59152653A (ja) レジンパツケ−ジ型半導体装置
JPH0631723Y2 (ja) 半導体装置
JP3029378U (ja) 半導体装置
JPS5931862B2 (ja) 半導体装置
JPH039597A (ja) 回路基板の放熱構造
JP2888192B2 (ja) 表面実装部品の放熱構造
JPH0714021B2 (ja) 樹脂封止型半導体装置